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Nanovion
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Our Team
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Custom Nanoimprint Lithography Solutions

About Nanovion

At Nanovion, we specialize in providing end-to-end custom solutions for nanoimprint lithography (NIL), leveraging deep expertise in advanced materials, surface engineering, and precision tooling. Our services are designed to support partners across industries—from semiconductors and photonics to biomedical devices and flexible electronics. 

Explore Our Services

Discover how Nanovion can help your business with our range of services, including scientific research, technology development, and consulting.

Core Services

Custom Process Development

Prototyping & Small-Volume Production

Custom Process Development

  • Thermal NIL, UV-NIL, and hybrid imprint techniques
     
  • Material and resist optimization for specific substrates and applications
     
  • Multilayer alignment and overlay process engineering
     
  • Feature sizes down to sub-20nm with high fidelity

Mold Design & Fabrication

Prototyping & Small-Volume Production

Custom Process Development

  • E-beam patterned quartz, silicon, and hybrid molds
     
  • Flexible and conformal mold development for R2R and non-planar substrates

Prototyping & Small-Volume Production

Prototyping & Small-Volume Production

Prototyping & Small-Volume Production

  • Imprint-ready wafers and devices
     
  • Pilot runs for feasibility and early-stage product development

Surface Treatment & Coating Services

Surface Treatment & Coating Services

Prototyping & Small-Volume Production

  • Anti-adhesion coatings (SAMs), plasma/UV ozone surface conditioning
     
  • Integration with nanocoatings for functional surface properties

Metrology & Quality Control

Surface Treatment & Coating Services

Metrology & Quality Control

  • In-house AFM, SEM, profilometry, and optical inspection
     
  • Pattern transfer fidelity and defect analysis

Available In-House Systems

EVG®7200

Nanonex NX-2000

Nanonex NX-2000

  • Capabilities: UV-NIL, thermal NIL, SmartNIL® technology (fully automated high-resolution patterning)
     
  • Key Features:
     
  • Sub-20nm resolution with low-defect imprinting
     
  • Fully automated alignment with sub-100nm overlay precision
     
  • Compatible with 4", 6", and 8" wafers
     
  • Integrated UV curing and temperature control
     
  • Use Cases: High-fidelity pattern transfer for optics, metasurfaces, and photonics

Nanonex NX-2000

Nanonex NX-2000

Nanonex NX-2000

  • Capabilities: Thermal NIL with high pressure and temperature uniformity
     
  • Key Features:
     
  • High aspect ratio imprinting for 3D structures
     
  • Supports wafer sizes up to 6"
     
  • Step-and-repeat or full-wafer imprint modes
     
  • Air cushion press for bubble-free imprints
     
  • Use Cases: Master mold replication, pattern transfer on thermoplastics, R&D tooling

Custom-built Spin Coating & UV Curing Platforms

Custom-built Spin Coating & UV Curing Platforms

Custom-built Spin Coating & UV Curing Platforms

  • Resist Coating Capabilities:
     
  • Uniform spin-coating down to 50 nm film thickness
     
  • Substrate size support: pieces up to 6" wafers
     
  • UV Curing:
     
  • High-intensity collimated UV light for rapid resist curing
     
  • Wavelengths: 365 nm and 405 nm options
     
  • Use Cases: Photoresist deposition, imprint resist curing, custom resist trials

AFM, SEM, and Optical Profilometry

Custom-built Spin Coating & UV Curing Platforms

Custom-built Spin Coating & UV Curing Platforms

  • Bruker Dimension Icon AFM: High-resolution 3D surface imaging (sub-nm vertical resolution)
     
  • Thermo Fisher SEM (Helios Series): Cross-section and surface imaging of nanoimprint features
     
  • Zygo Optical Profilometer: Non-contact step height and roughness analysis
     
  • Ellipsometry (J.A. Woollam): Thin film thickness and optical constant extraction

Engagement Models

Feasibility Studies & Prototyping

Feasibility Studies & Prototyping

Feasibility Studies & Prototyping

Quick-turn projects to demonstrate NIL performance for your specific use case.


  • What’s included:
     
    • Custom process design (UV or thermal NIL)
       
    • Imprint trials on customer or standard substrates
       
    • Basic pattern metrology (SEM, profilometry, AFM)
       
  • Typical duration: 4–8 weeks
     
  • Ideal for: Universities, startups, product development teams validating NIL viability

Contract R&D

Feasibility Studies & Prototyping

Feasibility Studies & Prototyping

Applied development tailored to client applications with structured milestones and regular deliverables.


  • Focus Areas:
     
    • Pattern replication and resist/material compatibility
       
    • Mold optimization and surface treatment
       
    • Process tuning for specific device stacks
       
  • Deliverables: Data reports, imprinted substrates, transferable process recipes
     
  • Duration: 1–6 months

Small-Batch Imprinting Services

Strategic Co-Development Partnerships (Selective)

Strategic Co-Development Partnerships (Selective)

Short-run nanoimprint manufacturing for pre-production or demonstration purposes.


  • Capabilities:
     
    • Up to 100 wafers/month (4”–6”)
       
    • Flexible substrate support (glass, Si, PET, etc.)
       
    • Integrated resist coating and curing
       
  • Applications: Optics, sensors, display films, photonic surfaces
     

Strategic Co-Development Partnerships (Selective)

Strategic Co-Development Partnerships (Selective)

Strategic Co-Development Partnerships (Selective)

We selectively engage in co-development projects with partners aligned on long-term NIL innovation.


  • Structure:
     
    • Joint roadmap definition
       
    • Shared access to tools and technical IP
       
    • Option for exclusive technology licenses
       
  • Limited availability: Based on strategic fit and bandwidth

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